SP202E

High Performance RS232 Transceivers
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Overview

Information High Performance RS232 Transceivers
Supply Voltage (Nom) (V) 5
No. of Tx 2
No. of Rx 2
Data Rate (kbps) 120
HBM ESD (kV) 15
IEC 61000-4-2 Contact (±kV) -
Int. Charge Pump
No. of Ext Caps 4
Nom Cap Value (µF) 0.1
Shutdown
Internal Caps
TTL Tri-State
Auto On-Line
VL Pin
Temperature Range (°C) 0 to 70, -40 to 85
Package NOIC-16, WSOIC-16
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The SP202E, SP232E, SP233E, SP310E and SP312E devices are a family of line driver and receiver pairs that meets the specifications of RS-232 and V.28 serial protocols. The devices are pin-to-pin compatible with MaxLinear's SP232A, SP233A, SP310A and SP312A devices as well as popular industry standard pinouts. The ESD tolerance has been improved on these devices to over +/-15kV for Human Body Model. This series offer a 120kbps data rate under load, small ceramic type 0.1µF charge pump capacitors and overall ruggedness for commercial applications. Features include MaxLinear's BiCMOS design which allowing low power operation without sacrificing performance. The series is available in lead free packages with commercial and industrial temperature ranges.


  • Operates from Single +5 Power Supply
  • Meets All RS-232D and ITU V.28 Specifications
  • Operates with 0.1uF to 10uF Capacitors
  • High Data Rate - 120Kbps Under Load
  • Low Power Shutdown
  • 3-State TTL/CMOS Receiver Outputs
  • Low Power CMOS - 3mA Operation
  • Improved ESD Specifications:
    • ±15kV Human Body Model

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets SP202E/SP232E/SP233E High Performance RS-232 Line Drivers / Receivers 1.0.2 May 2019 407 KB
Application Notes RS-232 and RS-485 PCB Layout Application Note R00 December 2022 2.8 MB
Application Notes ANI-19, Selecting Charge Pump Capacitors for Serial RS-232 Transceivers D July 2006 386.8 KB
Product Brochures Interface Brochure November 2023 3.7 MB
Product FAQs SP202E FAQ 1.0.0 August 2006 187.3 KB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP202ECN-L N Y Y Y Y L2 / 260ᵒC NSOIC16
SP202ECN-L/TR N Y Y Y Y L2 / 260ᵒC NSOIC16
SP202EEN-L N Y Y Y Y L2 / 260ᵒC NSOIC16
SP202EEN-L/TR N Y Y Y Y L2 / 260ᵒC NSOIC16
SP202ECT-L N Y Y Y Y L3 / 260ᵒC WSOIC16
SP202ECT-L/TR N Y Y Y Y L3 / 260ᵒC WSOIC16
SP202EET-L/TR N Y Y Y Y L3 / 260ᵒC WSOIC16

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now Order Samples PDN
SP202ECN NSOIC16 0 70 OBS SP202ECN-L
SP202ECN-L NSOIC16 0 70 Active Order
SP202ECN-L/TR NSOIC16 0 70 Active Order
SP202ECN/TR NSOIC16 0 70 OBS SP202ECN-L/TR
SP202ECP PDIP16 0 70 OBS SP202ECP-L
SP202ECP-L PDIP16 0 70 OBS SP202ECN-L
SP202ECT WSOIC16 0 70 OBS SP202ECT-L
SP202ECT-L WSOIC16 0 70 Active Order
SP202ECT-L/TR WSOIC16 0 70 Active Order
SP202ECT/TR WSOIC16 0 70 OBS SP202ECT-L/TR
SP202EEN NSOIC16 -40 85 OBS SP202EEN-L
SP202EEN-L NSOIC16 -40 85 Active Order
SP202EEN-L/TR NSOIC16 -40 85 Active Order
SP202EEN/TR NSOIC16 -40 85 OBS SP202EEN-L/TR
SP202EEP PDIP16 -40 85 OBS
SP202EEP-L PDIP16 -40 85 OBS SP202ECN-L
SP202EET WSOIC16 -40 85 OBS SP202EET-L
SP202EET-L WSOIC16 -40 85 OBS SP202EET-L/TR
SP202EET-L/TR WSOIC16 -40 85 Active Order
SP202EET/TR WSOIC16 -40 85 OBS SP202EET-L/TR
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC16
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 82.2ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 49
  • Quantity per Reel: 2500
  • Quantity per Tube: 49
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 9.90
  • Width: 3.90
  • Thickness: 1.75
  • Lead Pitch: 1.27
PDIP16
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.9ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 25
  • Quantity per Reel: n/a
  • Quantity per Tube: 25
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.75
  • Width: 0.25
  • Thickness: 0.13
  • Lead Pitch: 0.10
WSOIC16
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 47
  • Quantity per Reel: 1500
  • Quantity per Tube: 47
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 10.30
  • Width: 7.50
  • Thickness: 2.65
  • Lead Pitch: 1.27

Notifications

Distribution Date Description File
11/15/2017 Fab transfer including re-design for new foundry process rules. Qualification of TSMC foundry for 0.25um HV20 process. Addendum: Corrected Change Category from Material, Process and Other to Design and Process.
08/10/2017 Qualification of alternate assembly subcon, ANST.
08/07/2017 Fab transfer including re-design for new foundry process rules. Qualification of TSMC foundry for 0.25um HV20 process.
07/11/2017 Product Discontinuation Notification
12/19/2016 Qualification of alternate assembly subcon, ANST, China.
08/12/2016 Addition of an alternate qualified location, JCET, for assembly using copper wire bonding.
11/16/2015 Updated information subsequent to original published PCN 15-0625-02 on 09/29/2015. Addendum: Update to package marking.
09/29/2015 Greatek as alternate assembly site Addition of an alternate production site, Greatek, Taiwan for 16L, 24L and 28L SOICW
09/11/2015 Alternate assembly site Addition of an alternate assembly supplier Greatek in Taiwan.
01/27/2014 Addition of an alternate qualified 8, 14, 16, 40 PDIP assembly site, Greatek, Taiwan. Alternate assembly site.
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes.
07/02/2013 Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 14 and 16 lead NSOIC package using copper wire bonding. Material change.
09/24/2012 Material Change - Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity.
01/26/2011 Use 6’’ production line in the Silan, China wafer fabrication. Capacity enhancement.
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free).
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand
12/23/2008 ESD rating of +/- 15kV IEC 1000-4-2 Air Discharge and +/-8kV Contact Discharge are removed from the datasheets. Product re-characterization.
11/26/2008 Notice of Obsolescence Package Discontinuation Notice
09/29/2008 Product assembly of 14/16/18 lead PDIP families will be transferred from Unisem-Ipoh (Malaysia) to Unisem-Batam (Indonesia). Business consolidation and use of environmental friendly material.
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/12/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview wafer fabrication facility to wafer foundry Episil. See attached Product List. Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

FAQs & Support

Search our list of FAQs for answers to common technical questions.
For material content, environmental, quality and reliability questions review the Quality tab or visit our Quality page.
For ordering information and general customer service visit our Contact Us page.

Submit a Technical Support Question As a New Question

For RS-232 it is 50 feet (15 meters), or the cable length equal to a capacitance of 2500 pF, at a maximum transmission rate of 19.2kbps. When we reduce the baud rate, it allows for longer cable length. For Example:

 

Baud Rate (bps)

Maximum RS-232 Cable Length (ft)

19200

50

9600

500

4800

1000

2400

3000

 
For RS-485 / RS-422 the data rate can exceed 10Mbps depending on the cable length. A cable length of 15 meters (50 feet) will do a maximum of 10Mbps. A cable length of 1200 meters (4000 feet) will do a maximum of 90kbps over 24 AWG gauge twisted pair cable (with 10 pF/ft). Refer to Annex A TIA/EIA-422-B. Also refer the RS-485 Cable Lengths vs. Data Signaling Rate Application Note (AN-292).
 
 

The two parts are identical and come from the same basic die. The reason for the part labeling is historical. Other suppliers had different part numbers for similar function and we wanted to second source both products with enhanced performance at the time.

RS-232 uses both positive and negative voltages for signaling. The RS-232 driver needs a charge pump circuit to generate these signal voltages from a single Vcc supply. Four capacitors are needed to generate the positive (V+ or Vdd) and negative (V- or Vss) voltages.

ESD tests are “destructive tests.” The part is tested until it suffers damage. Therefore parts cannot be 100% tested in production, instead a sample of parts are characterized during the product qualification. The test procedure consists of “zapping” pins with a given voltage using the appropriate model and then running the part through electrical tests to check for functionality or performance degradation.

RS232 is the most widely implemented serial interface in the world. It is commonly installed as the serial port (9 pin or 25 pin) on PCs and has become ubiquitous on literally thousands of other applications. See below for comparisons.
 
Even though RS232 is a very old standard (first standardized in 1962) it is still popular because it is:
- simple, no software stack required, can be used to bring-up microcontrollers or load firmware on a “bare” system
- inexpensive, standard products exist from multiple vendors
- widely understood, support is already built in to most microcontrollers, the basics of serial communication are in most of the textbooks
- performance is adequate for many applications, simple data transfer, text or console ports, diagnostics, peripheral connectivity, etc.
 
However RS232 does have some limitations:
- It is slow by modern standards. Typical data rates are 1200 baud, 9600 baud, 115.2kbaud. High data rate RS232 devices are available up to 1Mbps. Faster speeds are uncommon.
- Signals swing to both positive and negative voltage. This requires an onboard charge pump to generate signals from a single power-supply chip or else multiple positive and negative supply rails.
- High pin-count per function. All signals are unidirectional and the charge pump requires several pins and external capacitors. So small footprint is difficult to achieve. Cables and connectors use more pins and wires than most modern serial protocols.
- Point-to-point only. Signals go from one driver to one receiver. RS232 does not support bi-directional signals or multiple drivers or receivers.
- Limited distance. RS232 uses single-ended signals which makes it difficult to support long cables. Typical RS232 cables are only about 10 meter or less. High speed (1Mbps) are typically less than 1 meter. The wide driver signal swing makes crosstalk a problem. Unbalanced signals with a shared ground reference are less able to withstand ground shifts between driver and receiver.
- Comparatively high power consumption. The wide signal swing takes quite a bit of power. By the RS232, signals idle at mark-state and receivers have typical 5kΩ impedance to ground, therefore drivers are constantly sourcing current even while idle. Many later RS232 transceivers’ feature shutdown modes or automatic power saving features (such as Auto On-Line, Auto On-Line Plus, Intelligent charge pumps, etc.). However some of the most commoditized devices lack any shutdown function.
 
RS485 overcomes most of the limitations of RS232 and is an excellent complement to RS232.
- RS485 uses differential signaling and is capable of much higher data rates (up to 20Mbit/sec)
- Differential signals also allow RS485 to communicate over 1200 meter cable lengths. Longer runs are possible with some careful system optimization.
- Bi-directional and multi-drop operation. RS485 can be used to build multidrop networks with many transmitters and many receivers.
- Balanced differential signalling also makes RS485 highly immune to noise. On twisted-pair cables a noise signal will couple equally to both wires in the pair and be ignored by the differential receiver.
 
RS485 is found mainly in industrial, telecom and commercial applications and is not as widespread in the consumer
or PC world. Therefore it is not seen as often as RS232.
 
Also the RS485 protocol standard defines only the electrical characteristics of the interface. The physical and logical implementations are left up to the user. Different connectors, different methods for bus-arbitration and data framing all exist under a wide variety of implementations. RS485 has also been used as the foundation for many proprietary or semi-proprietary standards. Therefore interoperability between RS485 based interfaces is not always as simple as with RS232.

ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.

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