SP3222E

3.0V to 5.5V RS-232 2-driver/2-receiver with low-power shutdown
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Overview

Information 3.0V to 5.5V RS-232 2-driver/2-receiver with low-power shutdown
Supply Voltage (Nom) (V) 3.3, 5
No. of Tx 2
No. of Rx 2
Data Rate (kbps) 120
HBM ESD (kV) 15
IEC 61000-4-2 Contact (±kV) 8
Int. Charge Pump
No. of Ext Caps 4
Nom Cap Value (µF) 0.1
Shutdown
Internal Caps
TTL Tri-State
Auto On-Line
VL Pin
Temperature Range (°C) 0 to 70, -40 to 85
Package TSSOP-20, SSOP-20, WSOIC-18
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The SP3222E/3232E series is an RS-232 transceiver solution intended for portable or hand- held applications such as notebook or palmtop computers. The SP3222E/3232E series has a high-efficiency, charge-pump power supply that requires only 0.1μF capacitors in 3.3V operation. This charge pump allows the SP3222E/3232E series to deliver true RS-232 performance from a single power supply ranging from +3.3V to +5.0V. The SP3222E/3232E are 2-driver/2-receiver devices. This series is ideal for portable or hand-held applications such as notebook or palmtop computers. The ESD tolerance of the SP3222E/3232E devices are over ±15kV for both Human Body Model and IEC1000-4-2 Air discharge test methods. The SP3222E device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. During shutdown, the supply current falls to less than 1μA.

  • Meets true EIA/TIA-232-F Standards from a +3.0V to +5.5V power supply
  • 250kbps Transmission Rate Under Load
  • 1µA Low-Power Shutdown with Receivers Active
  • Interoperable with RS-232 down to +2.7V power source
  • Enhanced ESD Specifications:
    • ±15kV Human Body Model
    • ±15kV IEC1000-4-2 Air Discharge
    • ±8kV IEC1000-4-2 Contact Discharge

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets SP3222E/SP3232E True +3.0V to +5.5V RS-232 Transceivers 1.0.3 May 2020 914.1 KB
Application Notes RS-232 and RS-485 PCB Layout Application Note R00 December 2022 2.8 MB
Application Notes ANI-10, Charge Pump Capacitor Selection Guide for 3V RS-232 Products B December 2006 71.8 KB
Product Brochures Interface Brochure November 2023 3.7 MB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP3222ECA-L/TR N Y Y Y Y L2 / 260ᵒC SSOP20
SP3222EEA-L/TR N Y Y Y Y L2 / 260ᵒC SSOP20
SP3222ECY-L/TR N Y Y Y Y L1 / 260ᵒC TSSOP20
SP3222EEY-L/TR N Y Y Y Y L1 / 260ᵒC TSSOP20
SP3222ECT-L/TR N Y Y Y Y L3 / 260ᵒC WSOIC18

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now Order Samples PDN
SP3222ECA SSOP20 0 70 OBS SP3222ECA-L
SP3222ECA-L SSOP20 0 70 OBS SP3222ECA-L/TR
SP3222ECA-L/TR SSOP20 0 70 Active Order
SP3222ECA/TR SSOP20 0 70 OBS SP3222ECA-L/TR
SP3222ECP PDIP18 0 70 OBS
SP3222ECP-L PDIP18 0 70 OBS
SP3222ECT WSOIC18 0 70 OBS SP3222ECT-L
SP3222ECT-L WSOIC18 0 70 OBS SP3222ECT-L/TR
SP3222ECT-L/TR WSOIC18 0 70 Active Order
SP3222ECT/TR WSOIC18 0 70 OBS SP3222ECT-L/TR
SP3222ECY TSSOP20 0 70 OBS SP3222ECY-L
SP3222ECY-L TSSOP20 0 70 OBS SP3222ECY-L/TR
SP3222ECY-L/TR TSSOP20 0 70 Active Order
SP3222ECY/TR TSSOP20 0 70 OBS SP3222ECY-L/TR
SP3222EEA SSOP20 -40 85 OBS SP3222EEA-L
SP3222EEA-L SSOP20 -40 85 OBS SP3222EEA-L/TR
SP3222EEA-L/TR SSOP20 -40 85 Active Order
SP3222EEA/TR SSOP20 -40 85 OBS SP3222EEA-L/TR
SP3222EEP PDIP18 -40 85 OBS
SP3222EEP-L PDIP18 -40 85 OBS
SP3222EET WSOIC18 -40 85 OBS SP3222EET-L
SP3222EET-L WSOIC18 -40 85 OBS SP3222ECT-L/TR
SP3222EET-L/TR WSOIC18 -40 85 OBS SP3222ECT-L/TR
SP3222EET/TR WSOIC18 -40 85 OBS SP3222EET-L/TR
SP3222EEY TSSOP20 -40 85 OBS SP3222EEY-L
SP3222EEY-L TSSOP20 -40 85 OBS SP3222EEY-L/TR
SP3222EEY-L/TR TSSOP20 -40 85 Active Order
SP3222EEY/TR TSSOP20 -40 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
PDIP18
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: n/a
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: n/a
  • Quantity per Tube: 20
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.90
  • Width: 0.25
  • Thickness: 0.13
  • Lead Pitch: 0.10
SSOP20
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 83ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 66
  • Quantity per Reel: 1500
  • Quantity per Tube: 66
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 7.20
  • Width: 5.30
  • Thickness: 2.00
  • Lead Pitch: 0.65
TSSOP20
  • JEDEC Reference: MO-153
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 110.7ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 74
  • Quantity per Reel: 2500
  • Quantity per Tube: 74
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 6.5
  • Width: 4.4
  • Thickness: 1.2
  • Lead Pitch: 0.65
WSOIC18
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: n/a
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 41
  • Quantity per Reel: 1500
  • Quantity per Tube: 41
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 11.55
  • Width: 7.50
  • Thickness: 2.65
  • Lead Pitch: 1.27

Notifications

Distribution Date Description File
08/30/2021 Addendum 08/26/2021: Remove EOL part → SP3222EEY-L, reference PDN 17-0626-02
08/13/2021 MaxLinear has qualified Key Foundry wafer foundry in order to increase production capacity and to facilitate long term support of the product line. The wafer process is 0.18um BCD. There is no change to form, fit, function and the products meet existing datasheet specifications. In addition to the currently qualified ANST site, Greatek is added as an alternate site for package, assembly, and test. There are no changes in device reliability.
08/10/2017 Qualification of alternate assembly subcon, ANST.
08/10/2017 Fab transfer including re-design for new foundry process rules. Qualification of TSMC foundry for 0.25um HV20 process.
07/11/2017 Product Discontinuation Notification
05/10/2017 Qualification of alternate assembly subcon, JCET.
02/23/2017 Qualification of alternate assembly subcon, ANST, China.
02/15/2017 Qualification of alternate assembly subcon, ANST.
02/14/2017 Qualification of alternate assembly subcon, GREATEK, Taiwan.
08/11/2016 Qualification of alternate assembly subcon, JCET.
07/26/2016 Product discontinuation notification. Discontinued.
02/26/2014 Qualification of an alternate qualified 18L WSOIC production site, Greatek, Taiwan, in addition to the current production site, Cirtek, Philippines. Alternate assembly site.
09/09/2013 Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 20 and 28 lead SSOP package using copper wire bonding. Material Change
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes.
07/03/2013 Addition of qualified 6 inch wafer processing line in Episil, in addition to the currently qualified 5 inch wafer processing line. Other change (foundry 6 inch wafer qualification).
05/23/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change.
08/24/2012 Material Change - Bond wire is changed from gold to copper. To update our manufacturing to be compatible with current industry standards and maintain capacity.
06/06/2011 Material Change: Convert all products in 20ld TSSOP package to Green (halogen-free) material using the same Bill of Material as 16ld TSSOP. Migrating to green environment and material standardization.
05/10/2011 Product Discontinuation Notice. Discontinued due to low market demand.
07/15/2010 Change in packing quantity per reel and also carrier tape width/pitch. Standardization
05/19/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand
11/26/2008 Notice of Obsolescence Package Discontinuation Notice
11/07/2008 1. Assembly of 18ld WSOIC will be moved from Unisem-Malaysia to MMS in Shanghai, China which is an alternate qualified supplier. 2. Mold compound is changed from Sumitomo non green 6730B-L to Sumitomo G600. Unisem Corporation is ending the life of this package lead count in their assembly offerings.
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.
06/26/2006 Change in ABSOLUTE MAXIMUM RATINGS of Input Voltages from: “-0.3V to +6.0V” to “-0.3V to Vcc + 0.3V” for the following pins (as appropriate to the specific product): TxIN, /EN,/ONLINE, /SHUTDOWN, EN SHDN, /SHDN The datasheets originally mis-specified the absolute maximum ratings of the above listed pins.
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
01/17/2006 Announcing discontinuance of certain low volume Power Management and Interface Products and last dates to place lifetime. buy orders Low Volume Power Management and Interface products are being discontinued due to cessation of operations of the Sipex Hillview Fabrication manufacturing site.

FAQs & Support

Search our list of FAQs for answers to common technical questions.
For material content, environmental, quality and reliability questions review the Quality tab or visit our Quality page.
For ordering information and general customer service visit our Contact Us page.

Submit a Technical Support Question As a New Question

For RS-232 it is 50 feet (15 meters), or the cable length equal to a capacitance of 2500 pF, at a maximum transmission rate of 19.2kbps. When we reduce the baud rate, it allows for longer cable length. For Example:

 

Baud Rate (bps)

Maximum RS-232 Cable Length (ft)

19200

50

9600

500

4800

1000

2400

3000

 
For RS-485 / RS-422 the data rate can exceed 10Mbps depending on the cable length. A cable length of 15 meters (50 feet) will do a maximum of 10Mbps. A cable length of 1200 meters (4000 feet) will do a maximum of 90kbps over 24 AWG gauge twisted pair cable (with 10 pF/ft). Refer to Annex A TIA/EIA-422-B. Also refer the RS-485 Cable Lengths vs. Data Signaling Rate Application Note (AN-292).
 
 

RS-232 uses both positive and negative voltages for signaling. The RS-232 driver needs a charge pump circuit to generate these signal voltages from a single Vcc supply. Four capacitors are needed to generate the positive (V+ or Vdd) and negative (V- or Vss) voltages.

ESD tests are “destructive tests.” The part is tested until it suffers damage. Therefore parts cannot be 100% tested in production, instead a sample of parts are characterized during the product qualification. The test procedure consists of “zapping” pins with a given voltage using the appropriate model and then running the part through electrical tests to check for functionality or performance degradation.

RS232 is the most widely implemented serial interface in the world. It is commonly installed as the serial port (9 pin or 25 pin) on PCs and has become ubiquitous on literally thousands of other applications. See below for comparisons.
 
Even though RS232 is a very old standard (first standardized in 1962) it is still popular because it is:
- simple, no software stack required, can be used to bring-up microcontrollers or load firmware on a “bare” system
- inexpensive, standard products exist from multiple vendors
- widely understood, support is already built in to most microcontrollers, the basics of serial communication are in most of the textbooks
- performance is adequate for many applications, simple data transfer, text or console ports, diagnostics, peripheral connectivity, etc.
 
However RS232 does have some limitations:
- It is slow by modern standards. Typical data rates are 1200 baud, 9600 baud, 115.2kbaud. High data rate RS232 devices are available up to 1Mbps. Faster speeds are uncommon.
- Signals swing to both positive and negative voltage. This requires an onboard charge pump to generate signals from a single power-supply chip or else multiple positive and negative supply rails.
- High pin-count per function. All signals are unidirectional and the charge pump requires several pins and external capacitors. So small footprint is difficult to achieve. Cables and connectors use more pins and wires than most modern serial protocols.
- Point-to-point only. Signals go from one driver to one receiver. RS232 does not support bi-directional signals or multiple drivers or receivers.
- Limited distance. RS232 uses single-ended signals which makes it difficult to support long cables. Typical RS232 cables are only about 10 meter or less. High speed (1Mbps) are typically less than 1 meter. The wide driver signal swing makes crosstalk a problem. Unbalanced signals with a shared ground reference are less able to withstand ground shifts between driver and receiver.
- Comparatively high power consumption. The wide signal swing takes quite a bit of power. By the RS232, signals idle at mark-state and receivers have typical 5kΩ impedance to ground, therefore drivers are constantly sourcing current even while idle. Many later RS232 transceivers’ feature shutdown modes or automatic power saving features (such as Auto On-Line, Auto On-Line Plus, Intelligent charge pumps, etc.). However some of the most commoditized devices lack any shutdown function.
 
RS485 overcomes most of the limitations of RS232 and is an excellent complement to RS232.
- RS485 uses differential signaling and is capable of much higher data rates (up to 20Mbit/sec)
- Differential signals also allow RS485 to communicate over 1200 meter cable lengths. Longer runs are possible with some careful system optimization.
- Bi-directional and multi-drop operation. RS485 can be used to build multidrop networks with many transmitters and many receivers.
- Balanced differential signalling also makes RS485 highly immune to noise. On twisted-pair cables a noise signal will couple equally to both wires in the pair and be ignored by the differential receiver.
 
RS485 is found mainly in industrial, telecom and commercial applications and is not as widespread in the consumer
or PC world. Therefore it is not seen as often as RS232.
 
Also the RS485 protocol standard defines only the electrical characteristics of the interface. The physical and logical implementations are left up to the user. Different connectors, different methods for bus-arbitration and data framing all exist under a wide variety of implementations. RS485 has also been used as the foundation for many proprietary or semi-proprietary standards. Therefore interoperability between RS485 based interfaces is not always as simple as with RS232.

ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.

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