SP213E

5V, 4-driver/5-receiver RS-232, with Shutdown and Wakeup, +/-15KV ESD
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Overview

Information 5V, 4-driver/5-receiver RS-232, with Shutdown and Wakeup, +/-15KV ESD
Supply Voltage (Nom) (V) 5
No. of Tx 4
No. of Rx 5
Data Rate (kbps) 120
HBM ESD (kV) 15
IEC 61000-4-2 Contact (±kV) 8
Int. Charge Pump
No. of Ext Caps 4
Nom Cap Value (µF) 0.1
Shutdown
Internal Caps
TTL Tri-State
Auto On-Line
VL Pin
Temperature Range (°C) 0 to 70, -40 to 85
Package SSOP-28
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The SP207E-SP213E are enhanced transceivers intended for use in RS-232 and V.28 serial communication. These devices feature very low power consumption and single-supply operation making them ideal for space-constrained applications. MaxLinear on-board charge pump circuitry generates fully compliant RS-232 voltage levels using small and inexpensive 0.1ìF charge pump capacitors. External +12V and -12V supplies are not required. The SP211E and SP213E feature a low-power shutdown mode, which reduces power supply drain to 1ìA. SP213E includes two receivers that remain active during shutdown to monitor for signal activity.

The SP207E-SP213E devices are pin-to-pin compatible with our previous SP207, SP208, SP21111 and SP213 as well as industry-standard competitor devices. Driver output and receiver input pins are protected against ESD to over ±15kV for both Human Body Model and IEC61000-4-2 Air Discharge test methods. Data rates of 120kbps are guaranteed, making them compatible with high speed modems and PC remote-access applications. Receivers also incorporate hysteresis for clean reception of slow moving signals.

  • Meets All EIA-232 and ITU V.28 Specifications
  • Single +5V Supply Operation
  • 3mA Typical Static Supply Current
  • 4 x 0.1µF External Charge Pump Capacitors
  • 120kbps Transmission Rates
  • Standard SOIC and SSOP Footprints
  • 1μA Shutdown Mode (SP211E & SP213E)
  • Two Wake-Up Receivers (SP213E)
  • Tri-State/RxEnable (SP211E & SP213E)
  • Improved ESD Specifications:
    • ±15kV Human Body Model
    • ±15kV IEC61000-4-2 Air Discharge
    • ±8kV IEC61000-4-2 Contact Discharge

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets SP208E–SP213E Low Power, High ESD +5V RS-232 Transceivers 2.0.0 January 2021 693.4 KB
Application Notes RS-232 and RS-485 PCB Layout Application Note R00 December 2022 2.8 MB
Application Notes ANI-19, Selecting Charge Pump Capacitors for Serial RS-232 Transceivers D July 2006 386.8 KB
Product Brochures Interface Brochure November 2023 3.7 MB
Product FAQs SP213E FAQ 1.0.0 March 2007 165.7 KB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP213ECA-L/TR N Y Y Y Y L2 / 260ᵒC SSOP28
SP213EEA-L/TR N Y Y Y Y L2 / 260ᵒC SSOP28

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now Order Samples PDN
SP213ECA SSOP28 0 70 OBS
SP213ECA-L SSOP28 0 70 OBS SP213ECA-L/TR
SP213ECA-L/TR SSOP28 0 70 Active Order
SP213ECA/TR SSOP28 0 70 OBS
SP213ECT WSOIC28 0 70 OBS
SP213ECT-L WSOIC28 0 70 OBS
SP213ECT-L/TR WSOIC28 0 70 OBS
SP213ECT/TR WSOIC28 0 70 OBS
SP213EEA SSOP28 -40 85 OBS
SP213EEA-L SSOP28 -40 85 OBS SP213EEA-L/TR
SP213EEA-L/TR SSOP28 -40 85 Active Order
SP213EEA/TR SSOP28 -40 85 OBS
SP213EET WSOIC28 -40 85 OBS
SP213EET-L WSOIC28 -40 85 OBS
SP213EET-L/TR WSOIC28 -40 85 OBS
SP213EET/TR WSOIC28 -40 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
SSOP28
  • JEDEC Reference: MO-150
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 67.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 46
  • Quantity per Reel: 1500
  • Quantity per Tube: 46
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 10.20
  • Width: 5.30
  • Thickness: 2.00
  • Lead Pitch: 0.65
WSOIC28
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 58.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 27
  • Quantity per Reel: 1500
  • Quantity per Tube: 27
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 17.90
  • Width: 7.50
  • Thickness: 2.65
  • Lead Pitch: 1.27

Notifications

Distribution Date Description File
10/26/2020 MaxLinear has qualified TSMC Fab 10 wafer foundry in Shanghai in order to facilitate long term support of the product line. The wafer process is 0.25um CMOS High Voltage Mixed Signal. The process has been optimized to produce very similar product characteristics as the currently shipping devices from Silan foundry and will meet existing datasheet specifications with the below exceptions.(See PCN for details)
02/05/2018 Add additional option for SSOP 28 packing: 16mm width size of tape & reel.
07/11/2017 Product Discontinuation Notification
07/11/2017 Product Discontinuation Notification
07/10/2017 Material Change. JCET qualification to use Tongling Poongsan Sanjia lead frame and HITACHI CEL-9240 mold compound for SSOP 28L package.
02/23/2017 Qualification of alternate assembly subcon, ANST, China.
02/15/2017 Qualification of alternate assembly subcon, ANST.
02/14/2017 Qualification of alternate assembly subcon, GREATEK, Taiwan.
08/11/2016 Qualification of alternate assembly subcon, JCET.
07/26/2016 Product discontinuation notification. Discontinued.
10/03/2013 Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes.
07/26/2013 5-inch wafer with PSG 10KÅ passivation Material and other (foundry 6 inch wafer qualification) changes.
05/23/2013 Qualified copper wire bonding assembly in addition to currently qualified gold wire bonding assembly in Carsem. Material change.
02/07/2012 Material Change: Bond wire changed from gold to copper. To prevent a cost increase of product to customers due to the rising prices of gold.
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.
05/08/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication facility to wafer foundary Episil. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

FAQs & Support

Search our list of FAQs for answers to common technical questions.
For material content, environmental, quality and reliability questions review the Quality tab or visit our Quality page.
For ordering information and general customer service visit our Contact Us page.

Submit a Technical Support Question As a New Question

For RS-232 it is 50 feet (15 meters), or the cable length equal to a capacitance of 2500 pF, at a maximum transmission rate of 19.2kbps. When we reduce the baud rate, it allows for longer cable length. For Example:

 

Baud Rate (bps)

Maximum RS-232 Cable Length (ft)

19200

50

9600

500

4800

1000

2400

3000

 
For RS-485 / RS-422 the data rate can exceed 10Mbps depending on the cable length. A cable length of 15 meters (50 feet) will do a maximum of 10Mbps. A cable length of 1200 meters (4000 feet) will do a maximum of 90kbps over 24 AWG gauge twisted pair cable (with 10 pF/ft). Refer to Annex A TIA/EIA-422-B. Also refer the RS-485 Cable Lengths vs. Data Signaling Rate Application Note (AN-292).
 
 

The serial transceiver is a Physical Layer device and therefore does not require or utilize software drivers. You need to contact the vendor for the “Layer 2”/”Media Access Control Layer” chip to find the proper software you seek.

We do not recommend any filter caps on the inputs. If you do add filter caps, the corner frequency will be set by the capacitor and the input impedance of 400kΩ.

RS-232 uses both positive and negative voltages for signaling. The RS-232 driver needs a charge pump circuit to generate these signal voltages from a single Vcc supply. Four capacitors are needed to generate the positive (V+ or Vdd) and negative (V- or Vss) voltages.

ESD tests are “destructive tests.” The part is tested until it suffers damage. Therefore parts cannot be 100% tested in production, instead a sample of parts are characterized during the product qualification. The test procedure consists of “zapping” pins with a given voltage using the appropriate model and then running the part through electrical tests to check for functionality or performance degradation.

RS232 is the most widely implemented serial interface in the world. It is commonly installed as the serial port (9 pin or 25 pin) on PCs and has become ubiquitous on literally thousands of other applications. See below for comparisons.
 
Even though RS232 is a very old standard (first standardized in 1962) it is still popular because it is:
- simple, no software stack required, can be used to bring-up microcontrollers or load firmware on a “bare” system
- inexpensive, standard products exist from multiple vendors
- widely understood, support is already built in to most microcontrollers, the basics of serial communication are in most of the textbooks
- performance is adequate for many applications, simple data transfer, text or console ports, diagnostics, peripheral connectivity, etc.
 
However RS232 does have some limitations:
- It is slow by modern standards. Typical data rates are 1200 baud, 9600 baud, 115.2kbaud. High data rate RS232 devices are available up to 1Mbps. Faster speeds are uncommon.
- Signals swing to both positive and negative voltage. This requires an onboard charge pump to generate signals from a single power-supply chip or else multiple positive and negative supply rails.
- High pin-count per function. All signals are unidirectional and the charge pump requires several pins and external capacitors. So small footprint is difficult to achieve. Cables and connectors use more pins and wires than most modern serial protocols.
- Point-to-point only. Signals go from one driver to one receiver. RS232 does not support bi-directional signals or multiple drivers or receivers.
- Limited distance. RS232 uses single-ended signals which makes it difficult to support long cables. Typical RS232 cables are only about 10 meter or less. High speed (1Mbps) are typically less than 1 meter. The wide driver signal swing makes crosstalk a problem. Unbalanced signals with a shared ground reference are less able to withstand ground shifts between driver and receiver.
- Comparatively high power consumption. The wide signal swing takes quite a bit of power. By the RS232, signals idle at mark-state and receivers have typical 5kΩ impedance to ground, therefore drivers are constantly sourcing current even while idle. Many later RS232 transceivers’ feature shutdown modes or automatic power saving features (such as Auto On-Line, Auto On-Line Plus, Intelligent charge pumps, etc.). However some of the most commoditized devices lack any shutdown function.
 
RS485 overcomes most of the limitations of RS232 and is an excellent complement to RS232.
- RS485 uses differential signaling and is capable of much higher data rates (up to 20Mbit/sec)
- Differential signals also allow RS485 to communicate over 1200 meter cable lengths. Longer runs are possible with some careful system optimization.
- Bi-directional and multi-drop operation. RS485 can be used to build multidrop networks with many transmitters and many receivers.
- Balanced differential signalling also makes RS485 highly immune to noise. On twisted-pair cables a noise signal will couple equally to both wires in the pair and be ignored by the differential receiver.
 
RS485 is found mainly in industrial, telecom and commercial applications and is not as widespread in the consumer
or PC world. Therefore it is not seen as often as RS232.
 
Also the RS485 protocol standard defines only the electrical characteristics of the interface. The physical and logical implementations are left up to the user. Different connectors, different methods for bus-arbitration and data framing all exist under a wide variety of implementations. RS485 has also been used as the foundation for many proprietary or semi-proprietary standards. Therefore interoperability between RS485 based interfaces is not always as simple as with RS232.

ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.

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