Overview
| Information | 5V, Single Chip WAN Multi-Mode Serial Transceiver |
|---|---|
| Supported Protocols | RS232, RS449, EIA530, EIA530A, V.10, V.11, V.28, V.35, V.36, X.21 |
| Supply Voltage (Nom) (V) | 5 |
| No. of Tx | 7 |
| No. of Rx | 7 |
| Data Rate (Mbps) | 20 |
| HBM ESD (kV) | 2 |
| Internal Termination | V.35, V.11 |
| VL Pin | |
| Temperature Range (°C) | 0 to 70 |
| Package | LQFP-80 |
The SP507 is a monolithic IC that supports seven (7) popular serial interface standards for DTE/DCE connectivity. The seven (7) drivers and seven (7) receivers transmit and receive signals at over 20Mbps. The SP507 requires no additional external components for compliant operation for all seven (7) modes of operation. All necessary termination is integrated within the SP507 and is switchable when V.35 drivers, V.35 receivers, and V.11 receivers are used. The SP507 can operate as either a DTE or DCE.
Additional features include a latch enable pin with the driver and receiver address decoder. Tri-state ability for the driver and receiver outputs is controlled by supplying a 3-bit word into the address decoder. Four (4) drivers and four (4) receivers in the SP507 include separate enable pins for added convenience.
- Interface Modes Supported:
- RS-232 (V.28)
- X.21/RS-422 (V.11)
- EIA-530 (V.10 & V.11)
- EIA-530A (V.10 & V.11)
- RS-449 (V.10 & V.11)
- V.35 (V.35 & V.28)
- Software Selectable Protocols
- Highest Differential Transmission Rates available at over 20Mbps
- +5V Only Operation
- Seven (7) Drivers and Seven (7) Receivers
- Driver and Receiver Tri-state Control
- Internal Transceiver Termination Resistors for V.11 and V.35 Protocols
- Improved ESD Tolerance for Analog I/Os
- Compliant to NET1/2 and TBR2 Physical Layer Requirements
- Used in WAN Serial Ports in Routers Switches, DSU/CSU's and other Access Devices
- Available in 132-Lead Small Scale Ball Grid Array and 80-Lead MQFP
Documentation & Design Tools
Parts & Purchasing
| Part Number | Pkg Code | Min Temp | Max Temp | Status | Suggested Replacement | PDN |
|---|---|---|---|---|---|---|
| SP507CF | MQFP80 | 0 | 70 | OBS | ||
| SP507CF-L | MQFP80 | 0 | 70 | OBS | ||
| SP507CM-L | LQFP80 14x14 | 0 | 70 | OBS | SP508ECF-L |
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.
Packaging
| Pkg Code | Details | Quantities | Dimensions |
|---|---|---|---|
| LQFP80 14x14 |
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| MQFP80 |
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Notifications
FAQs & Support
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ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.
Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.
