CARLSBAD, Calif.--(BUSINESS WIRE)-- MaxLinear, Inc. (NASDAQ: MXL), a leader in high-performance analog, mixed-signal and connectivity semiconductor solutions, today announced the expansion of its AI infrastructure portfolio with two new 16V high-current electronic fuse (eFuse) solutions, the MxL745950 and MxL745951P. AI infrastructure is driving unprecedented increases in rack power density, power-domain complexity, and serviceability requirements. The devices are designed to help hyperscalers, OEMs, ODMs, and networking equipment providers protect, monitor, and manage critical power paths across AI servers, accelerator trays, data center switches, fan trays, power shelves, plug-in modules, and rack-scale platforms.

As AI clusters scale from server-centric deployments to rack-scale systems, power-path protection is becoming a mission-critical element of platform reliability. MaxLinear’s new eFuse portfolio brings together integrated hot-swap protection, scalable high-current operation, compact implementation, and intelligent monitoring to help customers improve uptime, isolate faults, accelerate root-cause analysis, and gain deeper visibility into power-domain behavior across large-scale AI deployments.

Industry demand for AI infrastructure continues to accelerate. Market research estimates that data center semiconductor revenue will reach approximately $843 billion by 2030. Hyperscaler capital spending is also rising sharply as operators expand AI compute capacity to support training, inference, and emerging agentic workloads. These trends are increasing the need for highly reliable power protection, telemetry, and serviceability across servers, networking systems, accelerator platforms, and rack-level infrastructure. Industry estimates place the global eFuse market at approximately $1.0B today, with growth expected through 2030 as electronic systems require more intelligent, compact, resettable, and programmable power protection. When viewed together with adjacent hot-swap and intelligent power-path protection ICs used in data center, telecom, automotive, and industrial infrastructure, the broader opportunity expands into a multi-billion-dollar power-protection market.

The MxL745950 is a 16V, 50A electronic fuse with 1mΩ on-resistance in a compact 5mm × 5mm LGA-32 package. It integrates current sensing, temperature monitoring, fault indication, programmable soft-start and parallel-operation capability for higher-current applications, such as servers, networking systems, and plug-in modules.

The MxL745951P is a 16V, 60A stackable eFuse with 0.79mΩ on-resistance, PMBus™/I²C interface support, high-precision telemetry, configurable protection thresholds, non-volatile fault recording, and active current balancing during start-up and steady-state operation. The device provides digital telemetry for input voltage, input current, input energy, output voltage, output current, input power, and output power, enabling platform designers to add more intelligent power monitoring and fault visibility in AI and high-performance computing infrastructure.

“As AI infrastructure scales, the opportunity is expanding beyond compute silicon into the control, power, and telemetry technologies required to operate dense racks reliably,” said Amit D. Bavisi, Ph.D., Senior Vice President and General Manager, Analog Mixed-Signal Business Unit at MaxLinear. “Our new eFuse solutions extend MaxLinear’s role across AI servers, accelerator trays, switches, fan trays, power shelves, and rack-level platforms by helping customers build more observable, serviceable, and resilient power architectures.”

Why AI Infrastructure Requires Intelligent Power Protection

• Rack-level fault isolation: Integrated protection and fault-management capabilities help isolate subsystem failures before they impact broader rack operation.
• Operational visibility: High-precision telemetry and fault recording help operators improve power-domain visibility and accelerate root-cause analysis.
• Scalable current handling: Parallel operation and active current balancing support increasingly dense AI platforms and higher-current accelerator deployments.
• Serviceability and uptime: Hot-swap and inrush-control capabilities help support maintenance and replacement workflows in live or service-sensitive infrastructure.
• Control-plane integration: Complements MaxLinear’s AI infrastructure portfolio spanning connectivity, monitoring, rack management, console access, telemetry, power management, and protection.

Optimized for AI Data Center Power Protection

• High-current capability: Up to 50A for MxL745950 and up to 60A for MxL745951P per device, with parallel operation support for higher-current applications.
• Low-loss integrated power path: Integrated MOSFETs with low on-resistance help reduce power loss and voltage droop in dense systems.
• Hot-swap and inrush control: Programmable or configurable soft-start helps limit inrush current during card insertion and backplane hot-plug events.
• Robust protection: Integrated UVP, OVP, OCP, SCP, OTP, MOSFET fault diagnosis, and fault reporting improve system protection and status visibility.
• Advanced telemetry and configurability: MxL745951P adds PMBus/I²C telemetry, configurable thresholds and timers, black-box fault recording, and NVM-based custom configuration storage.
• Compact footprint: 5mm × 5mm LGA-32 and 5mm × 4.5mm VQFN-26L packages support space-constrained board designs.

Product Summary

Product	Positioning	Key Specifications	Monitoring / interface	Package
MxL745950	16V/50A eFuse for servers, networking, plug-in modules, and compact power-path protection	4V to 16V input; up to 50A; 1mΩ RDS(ON)	Analog current sensing, temperature monitoring, fault indication	5mm × 5mm LGA-32
MxL745951P	16V/60A stackable eFuse for server/HPC, data center switches/routers, accelerator trays, and fan trays	2.9V to 16V input; up to 60A; 0.79mΩ RDS(ON)	PMBus/I²C telemetry, ±1% current monitoring accuracy, black-box fault recording, NVM configuration	5mm × 4.5mm VQFN-26L

OCP APAC 2026 Demonstration and Availability

MaxLinear will introduce its new eFuse portfolio at the 2026 OCP APAC Summit, taking place August 11-12, 2026 at TaiNEX2 in Taipei City, Taiwan. The MxL745950 and MxL745951P will be showcased at Booth PL33, alongside MaxLinear’s broader AI infrastructure portfolio for rack-scale management, connectivity, telemetry, power management, and protection. Customer meetings will be held in Meeting Room 4.

The MxL745950 and MxL745951P are sampling now with volume production expected in Q4 2026. Visit maxlinear.com/mxl745950 and maxlinear.com/mxl745951P for more information. Customers interested in evaluating the new eFuse solutions can contact MaxLinear for additional product information and availability details.

Product status	Event alignment	Booth
Sampling now; Production in Q4 2026	OCP APAC Summit, Aug. 11-12, 2026	TaiNEX2, Taipei City, PL33 and Meeting Room 4

About MaxLinear, Inc.

MaxLinear, Inc. (Nasdaq: MXL) is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multimarket applications. MaxLinear is headquartered in Carlsbad, California. For more information, please visit https://www.maxlinear.com/.

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