CARLSBAD, CA – (BUSINESS WIRE)– March 12, 2026 – MaxLinear, Inc. (Nasdaq: MXL), a leading provider of high‑speed interconnect ICs for data center, metro, and wireless transport networks, today announced it will showcase its next‑generation 1.6T PHY chipset at OFC 2026, March 17–19, in South Hall, Booth 1049. The portfolio includes the Rushmore 200G/lane PAM‑4 DSP family and the Washington 200G/lane TIA.
Rushmore is the first major high-speed DSP to be built entirely in Samsung technology, providing customers with a foundry second source and additional supply flexibility.
Rushmore will be showcased at the MaxLinear booth, as well as the Ethernet Alliance and OIF booths.
At the MaxLinear booth, two live demonstrations will highlight Rushmore’s performance, signal integrity, and diagnostics capabilities for next‑generation optical and electrical interfaces. One demonstration will show end‑to‑end optical link performance using the Rushmore 1.6T DSP with the Washington TIA and partner optics to transmit and receive 224Gb/s‑per‑lane data. A second demonstration will highlight Rushmore’s electrical performance, underscoring robust operation in demanding system environments. The demonstrated performance supports deployment across a wide range of data center use cases, from short‑reach multimode links to reaches of up to 2 km.
Rushmore will also be showcased in industry interoperability demonstrations at OFC. These include the Ethernet Alliance interoperability demonstration, showcasing compliance with emerging 224G Ethernet standards, and the OIF 224G CEI Very Short Reach (VSR) interoperability demonstration. Together, these demonstrations validate Rushmore’s readiness for next‑generation electrical interfaces and its compatibility across switches, optical modules, and high‑speed cabling solutions.
In addition to Rushmore demos, MaxLinear will also showcase customer optical modules featuring its Keystone 400G and 800G DSPs, as well as Rushmore DSPs, for fully retimed optical transceiver, LRO and AEC applications. Keystone DSPs have been widely adopted by module vendors and hyperscale data center customers worldwide, with millions of units shipped.
MaxLinear’s portfolio addresses both scale‑out and scale‑up networking architectures required for AI data center growth. The company’s roadmap spans optical and copper interconnects, delivering solutions optimized for power, reach, and system flexibility to support today’s high‑volume 400G and 800G deployments while enabling future 1.6T systems and beyond.
Comprehensive Connectivity Portfolio:
- Rushmore: 1.6T PAM‑4 DSP for sub‑25W optical modules, built on Samsung’s leading‑edge CMOS process, featuring the industry’s highest swing integrated driver and advanced capabilities such as IFEC, ILT, and MPI localization.
- Washington: Low‑power 224Gb/s four‑lane TIAs for retimed PAM‑4 IMDD applications.
- Keystone: Proven 400G and 800G DSPs deployed in data centers worldwide, offering high‑swing and driverless SKUs with full gearbox, reverse gearbox, cross‑bar, and legacy rate support.
- Topanga: Four‑ or eight‑channel, 100G‑per‑lane TIAs delivering superior performance, low cross‑talk, and low power consumption.
About MaxLinear, Inc.
MaxLinear, Inc. (Nasdaq: MXL) is a leading provider of radio frequency (RF), analog, digital, and mixed-signal integrated circuits for access and connectivity, wired and wireless infrastructure, and industrial and multi-market applications. MaxLinear is headquartered in Carlsbad, California.
For more information, please visit www.maxlinear.com.
