SP504

WAN Multi-Mode Serial Transceiver
OBS (Obsolete)
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Overview

Information WAN Multi-Mode Serial Transceiver
Supported Protocols RS232, RS449, EIA530, V.10, V.11, V.28, X.21, RS485, RS-422, V.35
Supply Voltage (Nom) (V) 5
No. of Tx 7
No. of Rx 7
HBM ESD (kV) 2
VL Pin
Package LQFP-80
Data Rate (kbps)
Internal Termination Basic
Temperature Range (°C) 0 to 70
Data Rate (Mbps) 10
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The SP504 is a single chip device that supports eight (8) physical serial interface standards for Wide Area Network Connectivity. The SP504 is fabricated using a low power BiCMOS process technology, and incorporates a Sipex patented (5,306,954) charge pump allowing +5V only operation. Seven (7) drivers and seven (7) receivers can be configured via software for any of the above interface modes at any time. The SP504 is suited for DTE-DCE applications. The SP504 requires only one external resistor per V.35 driver for compliant V.35 operation.


  • +5V Only
  • Seven (7) Drivers and Seven (7) Receivers
  • Driver and Receiver Tri-State Control
  • Reduced V.35 Termination Network
  • Pin Compatible with the SP503
  • Software Selectable Interface Modes:
    • RS-232E (V.28)
    • RS-422A (V.11, X.21)
    • RS-449 (V.11 & V.10)
    • RS-485
    • V.35
    • EIA-530 (V.11 & V.10)
    • EIA-530A (V.11 & V.10)
    • V.36

Documentation & Design Tools

All Types Application Notes Product Briefs & Brochures User Guides & Manuals
Type Title Version Date File Size
Application Notes RS-232 and RS-485 PCB Layout Application Note R00 December 2022 2.8 MB
Application Notes AN218, SP50x RS-232 Latch-up Prevention April 2013 178.8 KB
Application Notes ANI-14, DTE and DCE Terminology Explained B December 2006 25.4 KB
Application Notes ANI-17, Multiprotocol DTE and DCE Options B December 2006 34.6 KB
Application Notes ANI-06, Connecting the SP504 Multiprotocol Transceiver to the 85C30 Universal Enhanced Serial Communications Controller (ESCC) B November 2006 52.3 KB
Application Notes ANI-16, Design Guide for Multi-Protocol Serial Ports A November 2005 462.9 KB
Application Notes ANI-05, SP504 Application Note A November 2005 162 KB
User Guides & Manuals SP504-505 Evaluation Board Manual 3.0.0 October 2000 132.5 KB
Product FAQs SP504 FAQ 1.0.0 June 2006 210.2 KB
Design Solutions DS-27, Signal Routing Considerations for 80-Pin Multiprotocol Communications Interface Devices November 2007 246.6 KB
Product Brochures Interface Brochure October 2022 3.8 MB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP504MCM-L N Y Y Y Y LQFP80 12x12 Y

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement PDN
SP504MCF MQFP80 OBS
SP504MCF-L MQFP80 OBS
SP504MCF-L/TR MQFP80 OBS
SP504MCM-L LQFP80 14x14 0 70 OBS
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Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
LQFP80 14x14
  • JEDEC Reference: MS-026
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 36.8ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: 90
  • Quantity per Reel: 1000
  • Quantity per Tube: n/a
  • Quantity per Tray: 90
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 20
  • Tape & Reel Unit Orientation: Quadrant 2
  • Dimensions: mm
  • Length: 14.00
  • Width: 14.00
  • Thickness: 1.60
  • Lead Pitch: 0.65
MQFP80
  • JEDEC Reference: MS-022
  • MSL Pb-Free: L2a @ 250ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 44.0ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 500
  • Quantity per Tube: n/a
  • Quantity per Tray: 84
  • Reel Size (Dia. x Width x Pitch): 330 x 32 x 24
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 14.00
  • Width: 14.00
  • Thickness: 2.00
  • Lead Pitch: 0.65

Notifications

Distribution Date Description File
08/22/2019 Product Discontinuation Notice
10/03/2013 Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes.
10/03/2013 Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Material change and alternate assembly site.
07/30/2010 Process Change. Capacity enhancement.
10/22/2008 ESD rating of 500V HBM was added. Product Re-Characterization.
01/08/2008 Change of assembly subcontractor for all Sipex part numbers packaged in the 100 lead LQFP packages from Carsem to Unisem’s Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem’s Batam plant (formerly AIT). Current subcontractor, Carsem, is discontinuing the packages.
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

FAQs & Support

Search our list of FAQs for answers to common technical questions.
For material content, environmental, quality and reliability questions review the Quality tab or visit our Quality page.
For ordering information and general customer service visit our Contact Us page.

Submit a Technical Support Question As a New Question

ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.

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