Rugged 20Mbps, 8 Channel Multi-Protocol Transceiver with Programmable DCE/DTE and Termination Resistor
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Information Rugged 20Mbps, 8 Channel Multi-Protocol Transceiver with Programmable DCE/DTE and Termination Resistor
Supported Protocols RS232, RS449, EIA530, EIA530A, V.10, V.11, V.28, V.35, V.36, X.21
Supply Voltage (Nom) (V) 5
No. of Tx 8
No. of Rx 8
Data Rate (Mbps) 20
HBM ESD (kV) 15
Internal Termination Complete
VL Pin
Temperature Range (°C) 0 to 70, -40 to 85
Package LQFP-100
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The SP508E is a monolithic device that supports eight (8) popular serial interface standards for Wide Area Network (WAN) connectivity. The SP508E is fabricated using a low power BiCMOS process technology, and incorporates an Exar regulated charge pump allowing +5V only operation. Exar's patented charge pump provides a regulated output of +5.8V, which will provide enough voltage for compliant operation in all modes. Eight (8) drivers and eight (8) receivers can be configured via software for any of the above interface modes at any time. The SP508E requires no additional external components for compliant operation for all of the eight (8) modes of operation other than four capacitors used for the internal charge pump. All necessary termination is integrated within the SP508E and is switchable when V.35 drivers and V.35 receivers, or when V.11 receivers are used. The SP508E provides the controls and transceiver availability for operating as either a DTE or DCE.

Additional features with the SP508E include internal loopback that can be initiated in any of the operating modes by use of the LOOPBACK pin. While in loopback mode, receiver outputs are internally connected to driver inputs creating an internal signal path bypassing the serial communications controller for diagnostic testing. The SP508E also includes a latch enable pin with the driver and receiver address decoder. The internal V.11 or V.35 receiver termination can be switched off using a control pin (TERM_OFF) for monitoring applications. All eight (8) drivers and receivers in the SP508E include separate enable pins for added convenience. The SP508E is ideal for WAN serial ports in networking equipment such as routers, access concentrators, network muxes, DSU/CSU's, networking test equipment, and other access devices.

Applicable U.S. Patents-5,306,954; and others patents pending.

  • 20Mbps Differential Transmission Rates
  • 15kV ESD Tolerance for Analog I/Os
  • Internal Transceiver Termination Resistors for V.11/V.35
  • Interface Modes:
    • RS-232 (V.28)
    • EIA-530 (V.10 & V.11)
    • X.21 (V.11)
    • EIA-530A (V.10 & V.11)
    • RS-449/V.36 – V.35 (V.10 & V.11)
  • Software Selectable Protocols with 3-Bit Word
  • Eight Drivers and Eight Receivers
  • V.35/V.11 Receiver Termination Network Disable Option
  • Internal Line or Digital Loopback Testing
  • Adheres to NET1/NET2 and TBR-2 Requireme
  • Easy Flow-Through Pinout
  • +5V Only Operation
  • Individual Driver/Receiver Enable/Disable Controls
  • Operates in DTE or DCE Mode

  • Router
  • Frame Relay
  • CSU
  • DSU
  • PBX
  • Secure Communication Terminals

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets SP508E Rugged 20Mbps, 8 Channel Multi-Protocol Transceiver with Programmable DCE/DTE and Termination Resistors 1.0.1 February 2020 670.4 KB
Application Notes Advantages of Designing with Multi-Protocol Transceivers Application Note R00 September 2023 2.5 MB
Application Notes RS-232 and RS-485 PCB Layout Application Note R00 December 2022 2.8 MB
Application Notes ANI-14, DTE and DCE Terminology Explained B December 2006 25.4 KB
Application Notes ANI-17, Multiprotocol DTE and DCE Options B December 2006 34.6 KB
Application Notes ANI-16, Design Guide for Multi-Protocol Serial Ports A November 2005 462.9 KB
Product Brochures Interface Brochure November 2023 3.7 MB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP508ECF-L N Y Y Y Y L3 / 260ᵒC LQFP100
SP508EEF-L N Y Y Y Y L3 / 260ᵒC LQFP100

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Buy Now Order Samples
SP508ECF-L LQFP100 0 70 Active Order
SP508EEF-L LQFP100 -40 85 Active Order

Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.


Pkg Code Details Quantities Dimensions PDF
  • JEDEC Reference: MS-026
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 45.7ºC/W
  • Bulk Pack Style: Tray
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 1000¹
  • Quantity per Tube: n/a
  • Quantity per Tray: 90
  • Reel Size (Dia. x Width x Pitch): 330 x 24 x 20
  • Tape & Reel Unit Orientation: Pin 1 at sprocket hole.
  • Dimensions: mm
  • Length: 14.00
  • Width: 14.00
  • Thickness: 1.60
  • Lead Pitch: 0.50


Distribution Date Description File
04/04/2017 Qualification of alternate assembly subcon, Greatek, Taiwan.
03/14/2016 Foundry line qualification. Addition of qualified 6 inch wafer processing line in Silan.
12/05/2013 Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Alternate assembly site.
10/03/2013 Qualification of SiO2 5KÅ + SiN 7KÅ passivation to replace PSG 10KÅ passivation. Material & Process Changes.
10/03/2013 Addition of an alternate qualified assembly site, ASE Chung-Li (Taiwan). Material change and alternate assembly site.
05/06/2013 Change in wafer fabrication foundry and part numbers. Qualification of an alternate qualified wafer foundry, Silan, in addition to the current wafer foundry, Episil Technologies. Process & datasheet changes.
03/08/2012 Wafer Fabrication Facility Wafer foundry request.
10/28/2009 Design and datasheet changes. To improve device performance and to center the propagation delay.
01/30/2009 Notice of Last-time Buy and Obsolescence Package Discontinuation Notice
01/08/2008 Change of assembly subcontractor for all Sipex part numbers packaged in the 100 lead LQFP packages from Carsem to Unisem’s Batam plant (formerly AIT), and conversion of all Sipex part number in 80 lead MQFP packages built at Carsem to 80 lead LQFP packages built at Unisem’s Batam plant (formerly AIT). Current subcontractor, Carsem, is discontinuing the packages.
06/26/2006 Amendment of PCN transferring certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Episil instead of Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

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Inverting the signals twice will cancel the delay thereby correcting the duty cycle. This comes at the cost of a channel, but it is a viable solution. Some of our customers do this in their systems.

Here are some basic calculations:
Icc(max) in EIA-530 mode (fully loaded, 10Mbps) = 270mA
--> P = 5V*270mA = 1350mW
So with Ta(max) = 70°C, and a package derating (Tja) of 52.7 ºC/W
--> Tj(max) = 70 + 1.350*52.7 = 141ºC

ESD is caused by static electricity. In order for an ESD event to occur there must be a buildup of static charge. Very high charge levels are actually quite rare. In a normal factory environment, taking basic ESD precautions (grounding-straps, anti-static smocks, ionizers, humidity control, etc.) static levels can be kept below a few tens of volts. In an uncontrolled environment, like an office, static levels rarely get above 2000 volts. Under some worstcase conditions (wearing synthetic fabrics, rubbing against synthetic upholstered furniture, extremely low humidity)
levels can go as high as 12 to 15 thousand volts. Actually to get to 15000 volts or higher you would need to be in an uncomfortably dry environment (humidity below 10%) otherwise static charge will naturally dissipate through corona discharge. It would definitely be considered a “bad hair day.” Humans can generally feel a static shock only above 3000 volts. A discharge greater than 4000 volts can cause an audible “pop.” But repeated lower level discharges can be imperceptible and still may have a cumulative damaging effect on sensitive ICs. All ICs, even those with robust protection, can be damaged if they are hit hard enough or often enough.

Actually the letter “E” could have two different meanings, depending on where it is in the part number. Most of our interface devices are available in different temperature grades. Commercial temperature (0 to 70C) has a “C” after the numeric part number. Industrial-extended temperature (-40 to +85C) use the letter E. So for example SP485CN is commercial and SP485EN is industrial. The second letter indicates the package type, in this case N for narrow-SOIC. Another E in the suffix indicates that this device has enhanced ESD protection, typically of ±15000Volts on the interface pins. Devices that do not have the enhanced ESD still contain built-in ESD protection of at least ±2000Volts. For example the SP485ECN is ESD rated up to ±15kV, and the SP485CN is rated for ±2kV HBM.

Most ICs in a typical system are at greatest risk of ESD damage in the factory when the PCB is assembled and the system is being built. After the system is put together they are soldered onto the PCB and shielded within a metal or plastic system enclosure. Interface ICs are designed to attach to an external connector that could be exposed to ESD when a cable is plugged in or when a person or object touches the connector. These interface pins are most likely to see ESD exposure and therefore benefit from additional protection.