1.2A Buck/Boost Charge Pump LED Driver
Data Sheets EOL (End of Life)


# of Channels 1
Max Current/Ch (mA) 1.2A
LEDs/ Ch. 1
Operating Voltage (MIN) (V) 2.7
Operating Voltage (MAX) (V) 5.5
Reference Voltage 50
Frequency (MHz) 2.4
Max Voltage (V) 5.5
Quiescent Current (μA) 500
Efficiency (%) 94
Package DFN-10
Application Flash
Features Charge pump topology, Enable pin, flash/torch mode, Adjustable flash current, soft-start Flash timeout protection, Overvoltage,
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  • Output current up to 1.2A
  • Up to 94% efficiency in torch mode
  • Adjustable FLASH mode current
  • Minimum external components: no inductors
  • Automatic buck/boost mode switchover
  • Wide VIN range: 2.7V to 5.5V
  • High frequency operation: 2.4MHz
  • 50mV reference for low loss sensing
  • IQ < 2μA in shutdown
  • PWM dimming control
  • Automatic soft-start limits inrush current
  • Overvoltage protection on output
  • Overcurrent/temperature protection
  • Low ripple and EMI
  • Ultra-low dropout voltage in buck mode
  • 2.6 second timeout in flash mode
  • Space saving RoHS compliant, lead free package: 10-pin 3mm x 3mm DFN

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets SP7685 1.2A Buck/Boost Charge Pump LED Driver T June 2006 262 KB
Application Notes AN200, Downloading and Installing CAD Symbols and Footprints with Ultra Librarian April 2019 1.2 MB
Application Notes ANP-17, Design Considerations For Cell Phone Camera Flash Drivers A November 2006 101.8 KB
Application Notes ANP-26, Powering LumiLEDs PWF4 with SP7685 1.2A Capable Charge Pump DC/DC A March 2006 195.9 KB
User Guides & Manuals SP7685 Evaluation Board Manual 1.0.0 February 2006 511.5 KB
Design Solutions DS-69, Applying a Supercap to the 1.2A Flash LED Charge Pump To Reduce Inrush Current In Boosting Mode July 2007 87.9 KB
Product Brochures Power Management Brochure October 2020 2.4 MB
Symbols & Footprints SP7685ER-L/TR CAD File (.bxl) September 2018 25.2 KB
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Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP7685ER-L/TR N Y Y Y Y L1 / 260ᵒC DFN10 3x3 OPT1

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now PDN
SP7685ER-L DFN10 3x3 OPT1 -40 85 OBS SP7685ER-L/TR
SP7685ER-L-ES DFN10 3x3 OPT1 -40 85 OBS
SP7685ER-L/TR DFN10 3x3 OPT1 -40 85 EOL
SP7685EB Board 0 85 OBS
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Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.


Pkg Code Details Quantities Dimensions PDF
DFN10 3x3 OPT1
  • JEDEC Reference:
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic:
  • ThetaJA: 40.5C/W
  • Bulk Pack Style: n/a
  • Quantity per Bulk Pack: n/a
  • Quantity per Reel: 3000
  • Quantity per Tube: n/a
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 3
  • Width: 3
  • Thickness: 1.00
  • Lead Pitch: 0.5


Distribution Date Description File
10/10/2023 Product Discontinuation Notice
01/31/2022 To increase manufacturing capacity, MaxLinear has qualified UTL3 extension site as an alternate assembly site together with UTL1 for QFN and DFN products.
01/27/2017 Qualification of alternate assembly subcon, ANST, China.
07/26/2016 Product discontinuation notification. Discontinued.
10/04/2013 Addition of an alternate qualified assembly site, UTAC Thailand, for assembly using copper or gold wire bonding. Material change and alternate assembly site.
04/09/2010 Change in wafer foundry Business consolidation

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