SP691A

Low Power Microprocessor Supervisory with Battery Switch-Over
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Overview

Information Low Power Microprocessor Supervisory with Battery Switch-Over
Package SOIC-16, WSOIC-16
Temperature Range (°C) 0 to 70,-40 to 85
# of Channels 1
VCC MIN (V) 1
VCC MAX (V) 5.5
Reset Threshold (V) 4.65
Reset Output Active-low, Active-high
Output Driver Type Push-pull
Reset Accuracy (mV) 125
Special Features Watchdog Timer, Back-up Battery Switchover, Power Fail-Low Battery Indicator, Chip Enable Gating
Watchdog Timeout (s) Adj
Reset Time Delay (ms) Adj
IQ (µA) typ 35
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  • Precision 4.65V/4.40V voltage monitoring
  • 200ms or adjustable reset time
  • 100ms, 1.6s or adjustable watchdog time
  • 60µA maximum operating supply current
  • 2.0µA maximum battery backup current
  • 0.1µA maximum battery standby current
  • Power switching
  • 250mA output in Vcc mode (0.6Ω)
  • 25mA output in battery mode (5Ω)
  • On-board gating of chip-enable signals
  • Memory write-cycle completion
  • 6ns CE gate propagation delay
  • Voltage monitor for power-fail or low battery
  • Backup-battery monitor
  • RESET valid to Vcc=1V
  • Pin compatible upgrade to MAX691A / MAX693A

Documentation & Design Tools

All Types Data Sheets Application Notes Product Briefs & Brochures Symbols & Footprints User Guides & Manuals
Type Title Version Date File Size
Data Sheets SP691A/693A/800L/800M Low Power Microprocessor Supervisory with Battery Switch-Over 1.0.0 December 2005 248.1 KB
Application Notes AN200, Downloading and Installing CAD Symbols and Footprints with Ultra Librarian April 2019 1.2 MB
User Guides & Manuals SP691A-693A Evaluation Board Manual 3.0.0 November 2007 54.1 KB
Product Brochures Power Management Brochure October 2020 2.4 MB
Symbols & Footprints SP691ACN-L & SP691ACN-L/TR CAD File (.bxl) September 2018 90.9 KB
Symbols & Footprints SP691ACT-L/TR CAD File (.bxl) September 2018 90.9 KB
Symbols & Footprints SP691AEN-L/TR CAD File (.bxl) September 2018 90.9 KB
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Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now Order Samples PDN
SP691ACN NSOIC16 0 70 OBS
SP691ACN/TR NSOIC16 0 70 OBS
SP691ACN-L NSOIC16 0 70 Active Order
SP691ACN-L/TR NSOIC16 0 70 OBS SP691ACN-L
SP691ACP PDIP16 0 70 OBS
SP691ACP-L PDIP16 0 70 OBS SP691ACT-L
SP691ACT WSOIC16 0 70 OBS
SP691ACT/TR WSOIC16 0 70 OBS
SP691ACT-L WSOIC16 0 70 OBS SP691ACT-L/TR
SP691ACT-L/TR WSOIC16 0 70 Active Order
SP691AEN NSOIC16 -40 85 OBS
SP691AEN/TR NSOIC16 -40 85 OBS
SP691AEN-L NSOIC16 -40 85 OBS SP691AEN-L/TR
SP691AEN-L/TR NSOIC16 -40 85 Active Order
SP691AEP PDIP16 -40 85 OBS
SP691AEP-L PDIP16 -40 85 OBS SP691AET-L
SP691AET WSOIC16 -40 85 OBS
SP691AET/TR WSOIC16 -40 85 OBS
SP691AET-L WSOIC16 -40 85 OBS SP691AET-L/TR
SP691AET-L/TR WSOIC16 -40 85 OBS SP691ACN-L/TR
SP691AXN NSOIC16 -40 85 OBS
SP691AXN-1 NSOIC16 -40 85 OBS
SP691AXN-2 NSOIC16 -40 85 OBS
SP691AXP PDIP16 -40 85 OBS
SP691AXP-1 PDIP16 -40 85 OBS
SP691AXP-2 PDIP16 -40 85 OBS
SP691AXT WSOIC16 -40 85 OBS
SP691AXT-1 WSOIC16 -40 85 OBS
SP691AXT-2 WSOIC16 -40 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC16
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L2 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 82.2ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 49
  • Quantity per Reel: 2500
  • Quantity per Tube: 49
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 9.90
  • Width: 3.90
  • Thickness: 1.75
  • Lead Pitch: 1.27
PDIP16
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.9ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 25
  • Quantity per Reel: n/a
  • Quantity per Tube: 25
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.75
  • Width: 0.25
  • Thickness: 0.13
  • Lead Pitch: 0.10
WSOIC16
  • JEDEC Reference: MS-013
  • MSL Pb-Free: L3 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 69.1ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 47
  • Quantity per Reel: 1500
  • Quantity per Tube: 47
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 16 x 12
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 10.30
  • Width: 7.50
  • Thickness: 2.65
  • Lead Pitch: 1.27

Notifications

Distribution Date Description File
12/12/2018 Product Discontinuation Notice
08/10/2017 Qualification of alternate assembly subcon, ANST.
07/11/2017 Product Discontinuation Notification
02/15/2017 Qualification of alternate assembly subcon, ANST.
07/26/2016 Product discontinuation notification. Discontinued.
11/16/2015 Updated information subsequent to original published PCN 15-0625-02 on 09/29/2015. Addendum: Update to package marking.
09/29/2015 Greatek as alternate assembly site Addition of an alternate production site, Greatek, Taiwan for 16L, 24L and 28L SOICW
07/02/2013 Addition of an alternate qualified assembly supplier, Carsem (Malaysia) for 14 and 16 lead NSOIC package using copper wire bonding. Material change.
10/17/2011 Product Discontinuation Notice. Selected Power Management products listed have been discontinued by Exar Corporation in their through-hole package form.
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free).
09/29/2008 Product assembly of 14/16/18 lead PDIP families will be transferred from Unisem-Ipoh (Malaysia) to Unisem-Batam (Indonesia). Business consolidation and use of environmental friendly material.
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

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