SP705

Low Power Microprocessor Supervisory Circuits
Data Sheets EOL (End of Life)

Overview

Information Low Power Microprocessor Supervisory Circuits
# of Channels 1
VCC MIN (V) 1
VCC MAX (V) 5.5
Reset Threshold (V) 4.65
Reset Output Active-low
Output Driver Type Push-pull
Reset Accuracy (mV) 125
Special Features Watchdog Timer, Manual Reset, Power Fail-Low Battery Indicator
Watchdog Timeout (s) 1.6
Reset Time Delay (ms) 200
Temperature Range (°C) 0 to 70,-40 to 85
Package NSOIC-8
IQ (µA) typ 40
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The SP705-708/813L series is a family of microprocessor (µA) supervisory circuits that integrate myriad components involved in discrete solutions which monitor power-supply and battery in mP and digital systems.

The SP705-708/813L series will significantly improve system reliability and operational efficiency when compared to solutions obtained with discrete components. The features of the SP705-708/813L series include a watchdog timer, a µP reset, a Power Fail Comparator, and a manual-reset input.

The SP705-708/813L series is ideal for applications in automotive systems, computers, controllers, and intelligent instruments. The SP705-708/813L series is an ideal solution for systems in which critical monitoring of the power supply to the µP and related digital components is demanded.

  • Precision voltage monitor:
  • RESET pulse width - 200ms
  • Independent watchdog timer - 1.6s
  • Timeout (SP705/706/813L/813M)
  • 60mA maximum supply current
  • Debounced TTL/CMOS manual reset input

Documentation & Design Tools

All Types Data Sheets Application Notes Product Briefs & Brochures Symbols & Footprints
Type Title Version Date File Size
Data Sheets SP705-SP708-SP813L Low Power Microprocessor Supervisory Circuits 2.1.1 February 2020 1.3 MB
Application Notes AN200, Downloading and Installing CAD Symbols and Footprints with Ultra Librarian April 2019 1.2 MB
Product Flyers Power Management & Interface Products for Cable, Satellite and IP STB/Home Gateway March 2018 2 MB
Product Brochures Power Management Brochure R03 April 2025 6.2 MB
Symbols & Footprints SP705CN-L/TR CAD File (.bxl) September 2018 76 KB
Symbols & Footprints SP705EN-L/TR CAD File (.bxl) September 2018 76 KB
Register for a myMxL account or Login to myMxL to view all Technical Documentation & Design Tools.

Quality & RoHS

Part Number RoHS | Exempt RoHS Halogen Free REACH TSCA MSL Rating / Peak Reflow Package
SP705CN-L/TR N Y Y Y Y L1 / 260ᵒC NSOIC8
SP705EN-L/TR N Y Y Y Y L1 / 260ᵒC NSOIC8

Click on the links above to download the Certificate of Non-Use of Hazardous Substances.

Additional Quality Documentation may be available, please Contact Support.

Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now PDN
SP705CN NSOIC8 0 70 OBS
SP705CN-L NSOIC8 0 70 OBS SP705CN-L/TR
SP705CN-L/TR NSOIC8 0 70 EOL None
SP705CN/TR NSOIC8 0 70 OBS
SP705CP PDIP8 0 70 OBS
SP705CP-L PDIP8 0 70 OBS
SP705CU MSOP8 0 70 OBS
SP705CU-L MSOP8 0 70 OBS
SP705CU-L/TR MSOP8 0 70 OBS SP705CN-L/TR
SP705CU/TR MSOP8 0 70 OBS
SP705EN NSOIC8 -40 85 OBS
SP705EN-L NSOIC8 -40 85 OBS SP705EN-L/TR
SP705EN-L/TR NSOIC8 -40 85 EOL None
SP705EN/TR NSOIC8 -40 85 OBS
SP705EP PDIP8 -40 85 OBS
SP705EP-L PDIP8 -40 85 OBS
SP705EU MSOP8 -40 85 OBS
SP705EU-L MSOP8 -40 85 OBS
SP705EU-L/TR MSOP8 -40 85 OBS
SP705EU/TR MSOP8 -40 85 OBS
SP705XN NSOIC8 -40 85 OBS
SP705XN-1 NSOIC8 -40 85 OBS
SP705XN-2 NSOIC8 -40 85 OBS
SP705XP PDIP8 -40 85 OBS
SP705XP-1 PDIP8 -40 85 OBS
SP705XP-2 PDIP8 -40 85 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 98
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.75
  • Lead Pitch: 1.27
PDIP8
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 84.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 50
  • Quantity per Reel: n/a
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.365
  • Width: 0.250
  • Thickness: 0.130
  • Lead Pitch: 0.100
MSOP8
  • JEDEC Reference: MO-187
  • MSL Pb-Free: L1 @ 260°C
  • MSL SnPb Eutectic:
  • ThetaJA: 163
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 50
  • Quantity per Reel: 2500
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330x12x8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 3
  • Width: 3
  • Thickness: 0.85
  • Lead Pitch: 0.65

Notifications

Distribution Date Description File
06/04/2025 Product Discontinuation Notice
07/17/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability. ADDENDUM A: Fixed MBB label logo for DX204001 to MaxLinear logo. ADDENDUM B: Replaced ‘All other affected products outer box label’ with clearer pictures. Corrected Date Issued (from original PCN) issue date +90 days to August 30, 2023.
06/01/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability.
06/01/2023 In 2023, MaxLinear will be converting all shipping labels for the parts noted from an EXAR format to MaxLinear’s label. During this transition customers may receive either label. This change affects only shipping and packing labels. This change will not affect the part number, part marking, manufacturing process or manufacturing sites. Only work in progress material will be converted. Existing inventory from MaxLinear’s warehouse, channel sales, distributor, and such, will not be converted. Hence, customers may experience receiving mixed shipments with both Exar and MaxLinear labels for some period until existing inventory of old labels is eventually cleared out. Situation is product to product with no predictable way to determine when all old labels will be exhausted. No change to product form, fit, function and reliability. ADDENDUM: Fixed MBB label logo for DX204001 to MaxLinear logo.
07/11/2017 Product Discontinuation Notification
02/15/2017 Qualification of alternate assembly subcon, ANST.
07/26/2016 Product discontinuation notification. Discontinued.
04/13/2016 Qualification of alternate assembly subcon, JCET.
03/14/2016 Foundry line qualification. Addition of qualified 6 inch wafer processing line in Silan.
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified.
08/29/2011 Material change: Mold compound and die attach material are changed and the listed parts will be fully Green (halogen-free). Migrating to green environment and material standardization.
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free).
09/17/2009 Datasheet change. Test conditions for RESET Output Voltage @ max voltage =0.30V is changed From: Vcc =1.1V, Isink =50ua To: Vcc =1.2V, Isink = 100ua
09/17/2009 Test conditions for RESET Output Voltage @ max voltage =0.30V is changed. Test standardization.
03/04/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.
10/16/2006 Adding “Note 1: WDI minimum rise/fall time is 1 microsecond.” to “WDI Pulse Width” specification The Schmitt trigger input on the WDI pin may not recognize signals with rise or fall times shorter than 1 microsecond.
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

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