SP813L

Low Power Microprocessor Supervisory Circuits

Overview

Information Low Power Microprocessor Supervisory Circuits
Package NSOIC-8
Temperature Range (°C) 0 to 70,-40 to 85
# of Channels 1
VCC MIN (V) 1.2
VCC MAX (V) 5.5
Reset Threshold (V) 4.65
Reset Output Active-high
Output Driver Type Push-pull
Reset Accuracy (mV) 125
Special Features Watchdog Timer, Manual Reset
Watchdog Timeout (s) 1.6
Reset Time Delay (ms) 200
IQ (µA) typ 40
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The SP705-708 / SP813L series is a family of microprocessor (μP) supervisory circuits that integrate myriad components involved in discrete solutions which monitor power-supply and battery in mP and digital systems.
 
The SP705-708 / SP813L series will significantly improve system reliability and operational efficiency when compared to solutions obtained with discrete components. The features of the SP705-708/813L series include a watchdog timer, a μP reset, a Power Fail Comparator, and a manual-reset input.
 
The SP705-708 / SP813L series is ideal for applications in automotive systems, computers, controllers, and intelligent instruments. The SP705-708/813L series is an ideal solution for systems in which critical monitoring of the power supply to the μP and related digital components is demanded.

  • Precision voltage monitor:
    • SP705/SP707/SP813L at 4.65V
    • SP706/SP708/SP813M at 4.40V
  • RESET pulse width - 200ms
  • Independent watchdog timer - 1.6s
  • Timeout (SP705/706/813L/813M)
  • 60mA maximum supply current
  • Debounced TTL/CMOS manual reset input
  • RESET asserted down to VCC = 1V
  • Voltage monitor for power failure or low battery warning
  • Available in 8-pin PDIP, NSOIC, and uSOIC packages
  • Pin compatible enhancement to industry standard 705-708/813L series
  • Functionally compatible to industry standard 1232 series

Documentation & Design Tools

Type Title Version Date File Size
Data Sheets SP705-SP708-SP813L Low Power Microprocessor Supervisory Circuits 2.1.1 February 2020 1.3 MB
Application Notes AN200, Downloading and Installing CAD Symbols and Footprints with Ultra Librarian April 2019 1.2 MB
Product Flyers Power Management & Interface Products for Cable, Satellite and IP STB/Home Gateway March 2018 2 MB
Product Brochures Power Management Brochure October 2020 2.4 MB
Symbols & Footprints SP813LEN-L/TR CAD File (.bxl) September 2018 76 KB
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Parts & Purchasing

Part Number Pkg Code Min Temp Max Temp Status Suggested Replacement Buy Now Order Samples PDN
SP813LCN NSOIC8 0 70 OBS
SP813LCN/TR NSOIC8 0 70 OBS
SP813LCN-L NSOIC8 0 70 OBS SP813LEN-L/TR
SP813LCN-L/TR NSOIC8 0 70 OBS SP813LEN-L/TR
SP813LCP PDIP8 0 70 OBS
SP813LCP-L PDIP8 0 70 OBS SP813LEN-L/TR
SP813LCU MSOP8 0 70 OBS
SP813LCU/TR MSOP8 0 70 OBS
SP813LCU-L MSOP8 0 70 OBS
SP813LCU-L/TR MSOP8 0 70 OBS
SP813LEN NSOIC8 -40 85 OBS
SP813LEN/TR NSOIC8 -40 85 OBS
SP813LEN-L NSOIC8 -40 85 OBS SP813LEN-L/TR
SP813LEN-L/TR NSOIC8 -40 85 Active Order
SP813LEP PDIP8 -40 85 OBS
SP813LEP-L PDIP8 -40 85 OBS SP813LEN-L/TR
SP813LEU MSOP8 -40 85 OBS
SP813LEU/TR MSOP8 -40 85 OBS
SP813LEU-L MSOP8 -40 85 OBS
SP813LEU-L/TR MSOP8 -40 85 OBS
SP813LXN NSOIC8 OBS
SP813LXN-1 NSOIC8 OBS
SP813LXN-2 NSOIC8 OBS
SP813LXP PDIP8 OBS
SP813LXP-1 PDIP8 OBS
SP813LXP-2 PDIP8 OBS
Show obsolete parts
Part Status Legend
Active - the part is released for sale, standard product.
EOL (End of Life) - the part is no longer being manufactured, there may or may not be inventory still in stock.
CF (Contact Factory) - the part is still active but customers should check with the factory for availability. Longer lead-times may apply.
PRE (Pre-introduction) - the part has not been introduced or the part number is an early version available for sample only.
OBS (Obsolete) - the part is no longer being manufactured and may not be ordered.
NRND (Not Recommended for New Designs) - the part is not recommended for new designs.

Packaging

Pkg Code Details Quantities Dimensions PDF
NSOIC8
  • JEDEC Reference: MS-012
  • MSL Pb-Free: L1 @ 260ºC
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 128.4ºC/W (std); 96.8ºC/W (fused)
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 98
  • Quantity per Reel: 2500
  • Quantity per Tube: 98
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330 x 12 x 8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 4.90
  • Width: 3.90
  • Thickness: 1.75
  • Lead Pitch: 1.27
PDIP8
  • JEDEC Reference: MS-001
  • MSL Pb-Free: n/a
  • MSL SnPb Eutectic: n/a
  • ThetaJA: 84.6ºC/W
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 50
  • Quantity per Reel: n/a
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): n/a
  • Tape & Reel Unit Orientation: n/a
  • Dimensions: inch
  • Length: 0.365
  • Width: 0.250
  • Thickness: 0.130
  • Lead Pitch: 0.100
MSOP8
  • JEDEC Reference: MO-220
  • MSL Pb-Free: L1 @ 260°C
  • MSL SnPb Eutectic:
  • ThetaJA: 163
  • Bulk Pack Style: Tube
  • Quantity per Bulk Pack: 50
  • Quantity per Reel: 2500
  • Quantity per Tube: 50
  • Quantity per Tray: n/a
  • Reel Size (Dia. x Width x Pitch): 330x12x8
  • Tape & Reel Unit Orientation: Quadrant 1
  • Dimensions: mm
  • Length: 3
  • Width: 3
  • Thickness: 1.1
  • Lead Pitch: 0.65

Notifications

Distribution Date Description File
07/11/2017 Product Discontinuation Notification
02/15/2017 Qualification of alternate assembly subcon, ANST.
07/26/2016 Product discontinuation notification. Discontinued.
04/13/2016 Qualification of alternate assembly subcon, JCET.
03/14/2016 Foundry line qualification. Addition of qualified 6 inch wafer processing line in Silan.
01/27/2014 Addition of an alternate qualified 8, 14, 16, 40 PDIP assembly site, Greatek, Taiwan. Alternate assembly site.
07/02/2013 Qualification of an alternate qualified PDIP assembly site, Cirtek (Philippines), in addition to the current assembly site, Unisem (Malaysia). Alternate assembly site.
07/02/2013 Qualification of an alternate qualified assembly supplier, ASE Chung-Li (Taiwan) for the 8L NSOIC package using copper wire bonding. Material change and alternate assembly supplier qualified.
12/07/2009 Enhancement of NSOIC 8, NSOIC14 and NSOIC16 packages to Green (halogen-free) via Mold Compound & Die Attach Material. Enhance packages to be Green (halogen-free).
03/04/2009 Notice of Obsolescence Discontinued by Exar Corporation due to low market demand
02/28/2007 Product Obsolescence Letter and Discontinuation Notification. Discontinued.
02/02/2006 Announcing transfer of certain Power Management and Interface Products from Hillview fabrication and facility to wafer foundary Silan. See attached Product List Power Management and Interface products as listed are being transfer to external wafer foundry, due to cessation of operations of the sipex Hillview Fabrication manufacturing site

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